[Hiring] Structural Analyst @Viasat, Inc.

Role Description

Perform detailed structural analysis of spacecraft primary and secondary structures, payload components, mechanisms, ground support equipment, and electronic packaging using finite element analysis and hand calculations.

• Develop conceptual structural models to support proposals and trade studies.
• Produce stress reports and slide packages to support design reviews.
• Evaluate structural impacts of design changes, materials, manufacturing processes, and interfaces.
• Support structural testing activities, including test plan development, fixture design, correlation of FEMs, and verification of requirements.
• Collaborate with mechanical design engineers, systems engineers, materials engineers, and thermal analysts to optimize hardware performance.
• Ensure compliance with applicable aerospace standards, including NASA, AIAA, and military standards.
• Communicate analysis results clearly to program teams, leadership, and external customers.

This position is ideal for an engineer who enjoys solving complex structural problems and brings experience in FEA for aerospace hardware.

Qualifications

• B.S. in Mechanical Engineering, Aerospace Engineering, or related field.
• 4+ years of relevant experience in structural analysis of spaceflight hardware.
• Proficiency with Nastran (MSC or Simcenter): static, normal modes, buckling, frequency response.
• Proficiency with Simcenter Femap modeling and post‑processing.
• Working knowledge of standard aerospace engineering materials, processes, and parts (metallics, polymers, composites, fasteners).
• Working knowledge of aerospace structural analysis and test methodologies, including:
  • Static analysis and test.
  • Normal modes and linear dynamics.
  • Random vibration and shock response analysis and test.
  • Fatigue and fracture-mechanics.
  • Composite materials and classical laminate theory.
  • Mechanism analysis.
  • Thermoelastic analysis.
  • Launch vehicle environments.
  • Semi-empirical methods (Bruhn, ECSS).
  • Bonded and bolted joint analysis.
• Working knowledge of electronic packaging structural analysis, including:
  • Printed wiring assembly (PWA) structural analysis.
  • Solder joint fatigue, including Steinberg random vibration fatigue methods.
  • Connector and interconnect reliability.
  • Thermal-mechanical coupled analysis of electronic assemblies.
• Demonstrated experience applying NASA, AIAA, ECSS, and MIL standards to structural design, testing, and qualification.
• Ability to generate high‑quality analysis documentation.
• Strong knowledge of mechanical design principles.
• Excellent communication skills and ability to work cross‑functionally in a multidisciplinary team.
• U.S. citizen, with ability to obtain a Secret-level security clearance.

Requirements

• M.S. in Mechanical Engineering, Aerospace Engineering, or related field.
• Experience with LS-DYNA, ANSYS, or Abaqus.
• Nonlinear and thermal‑structural coupled analyses.
• Vibroacoustic analysis.
• Coding experience using Python, MATLAB.

Benefits

• Salary range: $120,500.00 - $190,000.00 / annually.
• For specific work locations within San Jose, the San Francisco Bay area and New York City metropolitan area, the base pay range for this role is $149,500.00 - $224,500.00 / annually.
• Base pay may vary depending on job-related knowledge, skills, and experience.
• Additional cash or stock incentives may be provided as part of the compensation package.
• Range of medical, financial, and/or other benefits, dependent on the position offered.

Company Description

At Viasat, the work you do helps people stay connected in ways that matter, from everyday moments to critical missions across air, land, sea, and space.

We’re a place for people who are curious, bold, and motivated by meaningful work. Here, you'll have the opportunity to make an impact, explore new possibilities, and grow your career in ways that align with your interests and goals.