[Hiring] Manufacturing Engineer @Tenstorrent

Role Description

Tenstorrent is looking for a hands-on Manufacturing Engineer to own the manufacturing interface between package design, semiconductor assembly, package test, board assembly, and final product integration.

• This role is focused on making advanced packages manufacturable and transferable from design engineering into qualified OSAT processes and downstream board/system assembly.
• You will work closely with:
  • Packaging Engineering
  • Silicon Manufacturing and Test
  • Quality
  • Supply Chain
  • PCB/board design
  • External partners such as substrate suppliers, OSATs, test houses, and contract manufacturers.
• The ideal candidate understands how package decisions affect package yield, package test, PCB footprint and stencil design, SMT assembly, and final product readiness.
• This role is remote based out of Taiwan but requires close engagement with regional OSATs, foundry/test partners, contract manufacturers, and Tenstorrent engineering teams across multiple time zones.
• Regular on-site presence at partner factories is expected during qualification, commissioning, build, and ramp activities.
• We welcome candidates at various experience levels for this role.

Qualifications

• A manufacturing or process engineer with 5+ years of experience in semiconductor packaging, OSAT manufacturing, assembly engineering, PCBA manufacturing, product engineering, NPI, or a closely related environment.
• Experienced with semiconductor assembly, package manufacturing, package test, board assembly, final product manufacturing, or taking a package, assembly process, or manufacturing line from development through sustaining operations.
• Comfortable working directly with OSATs, substrate and bumping suppliers, test houses, contract manufacturers, and other external manufacturing partners.
• A data-driven problem solver and strong communicator who can interpret package drawings, BGA maps, BOMs, PCB data, process and quality reports, reliability results, and manufacturing documentation while driving decisions across engineering, operations, quality, and suppliers.

Requirements

• Translate package requirements into executable assembly process flows, manufacturing specifications, control plans, inspection requirements, acceptance criteria, supplier deliverables, and complete manufacturing documentation.
• Lead factory commissioning, line bring-up, pilot and engineering builds, qualification lots, first article and reliability activities, mass-production readiness reviews, and partner audits.
• Establish process capability and performance targets—including Cp/Cpk, yield, FPY, defect rates, test escapes, cycle time, OEE, and on-time delivery.
• Use structured methods such as SPC, DOE, PFMEA, 8D, CAPA, and data-driven problem solving to improve results.
• Own technical issue resolution and controlled change implementation across silicon, package, assembly, test, and factory operations.

What You Will Learn

• How Tenstorrent scales advanced silicon, package, test, and system manufacturing through a global OSAT and manufacturing-partner ecosystem.
• How to lead process transfer, factory commissioning, qualification, line bring-up, and production ramp for complex compute products.
• How silicon and package design decisions connect to test coverage, factory capability, quality performance, yield, reliability, and production cost.
• How to establish repeatable manufacturing operating mechanisms that support NPI, high-volume production, and sustaining engineering in a fast-moving environment.

Benefits

• Highly competitive compensation package and benefits.
• Equal opportunity employer.