[Hiring] Senior PCB DFx Engineer @Viasat, Inc.

Role Description

Join our Operations Engineering team as a technical leader focused on PCB materials and producibility, fabrication technologies, and design-for-excellence (DFx) for advanced electronic systems. You will partner with design, manufacturing, quality, program, and supplier teams to ensure robust, manufacturable, and highly reliable PCB designs supporting government, military, airborne, commercial, and space payload applications.

Key responsibilities include:

• Guide in HDI, RF/microwave, high-speed digital, rigid-flex, and high-reliability PCB technologies
• Review stack-ups, materials, controlled impedance requirements, via structures, fabrication drawings, and manufacturing specifications
• Lead PCB Design for Fabrication reviews from concept through production
• Collaborate with global PCB fabrication suppliers to optimize yield, quality, cost, and schedule
• Drive root-cause investigations and corrective actions for fabrication and reliability issues
• Develop and maintain PCB design guidelines, standards, and procedures across the enterprise
• Support multiple concurrent development programs and critical design reviews

Qualifications

• 10+ years' experience in PCB fabrication, PCB technology, DFx, or PCB manufacturing engineering experience
• Extensive knowledge of HDI fabrication, micro-vias, sequential lamination, controlled impedance, RF materials, and PCB technologies built for high reliability
• Solid understanding of IPC standards including IPC-2221/2222, IPC-601X, IPC-A-600, IPC-A-610, and J-STD-001
• Familiarity with Mentor Xpedition, Zuken, Cadence Allegro, Valor, CAM350, Minitab, Jira, Agile, and Oracle
• Proven experience supporting aerospace, defense, military, airborne, or space hardware programs
• Demonstrated ability to manage numerous projects and influence technical decisions across multi-functional teams
• Excellent communication, leadership, and problem-solving skills
• Bachelor's degree in Engineering or equivalent experience
• US Government position. US Citizenship required
• Active DoD Secret Clearance or ability to obtain when administratively feasible
• Ability to travel up to 20%

Requirements

• Experience with Class 3 and Space Addendum hardware
• Knowledge of RF/microwave and phased-array antenna PCB technologies
• IPC certifications (CID, CID+, CIT, or equivalent)
• Active DoD Secret Clearance

Benefits

• Salary range: $141,500.00 - $224,000.00 / annually
• For specific work locations within San Jose, the San Francisco Bay area, and New York City metropolitan area, the base pay range for this role is $176,000.00 - $264,000.00 / annually
• Base pay may vary depending on job-related knowledge, skills, and experience
• Additional cash or stock incentives may be provided as part of the compensation package
• Range of medical, financial, and/or other benefits, dependent on the position offered