[Hiring] R&D Engineer, Signal Integrity @Keysight Technologies, Inc.

Role Description

A major success factor for Keysight continues to be the development and deployment of breakthrough digital high speed designs at the forefront of industry standards that drive the performance, differentiation, and value of new products. We have an exciting opportunity for a highly motivated R&D Hardware Design Engineer to join our high speed signal integrity team. In this role, you will participate in the design and validation of high speed serial interfaces and in the selection of materials, design structures, and methodologies to achieve required design specifications and necessary SI margins and predicted performance.

• Collaborate across global teams to design, optimize, and implement PCB designs and subsystem solutions that meet test & measurement product functionality, performance, quality and schedule requirements.
• Modeling & optimization of high-frequency PCB, IC packages, substrates, and high-speed digital I/O interconnects operating at 100G/200G PAM4 and above.
• Close collaboration with system, hardware, board design, and test teams to develop and define hardware requirements, functionality, and performance needed to satisfy SI requirements.
• Identification of appropriate design structures, geometries, stackups to satisfy insertion loss, return loss, and overall SI requirements.
• Support and investigation of next generation materials and stackups/process in PCB fabrication to satisfy stringent SI needs.
• Collaboration with internal and external supply chain manufacturing partners to identify, develop, deploy, and execute new processes/materials.
• Collaboration with the development, test & reliability teams in the characterization and qualification of PCBA materials.

Qualifications

• BS or MS degree in Electrical Engineering or equivalent.
• Excellent communication skills.
• Excellent understanding of Electrical Engineering principles, Signal Integrity, RF/Microwave theory, and high frequency circuit design methodologies.
• Minimum 7+ years of experience (MS and 5 years) in hardware/circuit and IC package design, high-frequency modeling/optimization, or high-power density design.
• Fluent/Experienced in ANSYS HFSS and 3D-Layout and Polar Instruments.
• Familiarity with Allegro.
• Proven experience with semiconductor, packaging, substrates, and printed circuit board technologies, associated materials and copper roughness, manufacturing processes, and design methodologies.
• Understanding/familiarity with PCB design methodologies, processes, and workflows preferred.

Benefits

• Medical, dental and vision.
• Health Savings Account.
• Health Care and Dependent Care Flexible Spending Accounts.
• Life, Accident, Disability insurance.
• Business Travel Accident and Business Travel Health.
• 401(k) Plan.
• Flexible Time Off, Paid Holidays.
• Paid Family Leave.
• Discounts, Perks.
• Tuition Reimbursement.
• Adoption Assistance.
• ESPP (Employee Stock Purchase Plan).

Company Description