[Hiring] Lead Data Center Systems Architect/Engineer (Mechanical & Infrastructure) – AI Infrastructure & Data Center @Denvr Dataworks

Role Description

Denvr is seeking a Lead Systems Architect (Mechanical) who can bridge the gap between high-density thermodynamics and modular manufacturing. You will be responsible for the end-to-end lifecycle of our modular sites, from designing modular data centers to managing the manufacturing supply chain and ensuring the compute/network stack is seamlessly integrated.

What You’ll Do

• Tri-Hybrid Cooling Architecture: Aid the design team and manufacturing partners to optimize site-specific infrastructure across the entire thermal spectrum: Liquid Immersion, Direct-to-Chip (DTC), and High-Efficiency Air Cooling.
• Architect High-Density Sites: Design mechanical systems specifically tailored for NVIDIA GPU clusters (H100/H200/B300), ensuring the physical infrastructure can handle the massive thermal loads of generative AI.
• Drive Modular Innovation: Lead the design and fabrication of "plug-and-play" modular data center units, working directly with manufacturing partners to ensure precision and scalability.
• Coordinate Supply Chains: Act as the technical lead for vendor management, ensuring long-lead mechanical components (CDUs, manifolds, and heat exchangers) align with deployment timelines.
• Integrate Compute & Network: Collaborate with IT teams to ensure physical infrastructure supports complex network topologies and high-speed fiber requirements.
• Lead Commissioning: Oversee Level 4 and Level 5 commissioning to ensure that cooling, power, and compute are perfectly synchronized under full load.

Qualifications

• A degree in Mechanical Engineering (PEng).
• 7+ years of experience in data center or industrial modular design.

Requirements

• Hands-on experience with the deployment of Liquid Immersion tanks and Direct-to-Chip secondary loops.
• A deep understanding of traditional Air-Cooled psychrometrics and economization.
• Understanding of Design for Manufacturing (DFM) and experience working with modular fabrication plants or MEP skids.
• Understanding of how rack-level switching, fiber management, and high-density power draws impact the total system architecture.
• Comfortable traveling to manufacturing sites and project locations.

Technical Toolkit

• Cooling Tech: Expert-level knowledge of CDUs (Coolant Distribution Units), dielectric fluids, and manifold design.
• Design: Proficiency in AutoCAD, Revit, SolidWorks, and CFD software (e.g., 6SigmaET or FutureFacilities).
• Infrastructure: Deep understanding of PUE optimization across different cooling modalities.
• Compute: Familiarity with Layer 1-3 networking and high-density server deployments.

Benefits

• The opportunity to lead the physical deployment of a sovereign AI platform.
• Highly competitive base salary, performance bonuses, and equity.
• A leadership seat in a fast-scaling organization where infrastructure is the core product.