[Hiring] Hardware ASIC Packaging SI/PI Simulation and Design Lead @Cisco

Role Description

This Hardware Engineering position is located in San Jose, CA, and is open to remote applicants residing within the United States.

We are seeking a highly qualified Signal and Power Integrity Technical Lead to help us develop our next generation ASIC packaging to help define, design and verify ASIC packaging to be deployed in a range of Cisco platforms.

• Develop, document, and implement design rules for ultra-high-speed signaling, ensuring power, performance, and area goals are met for products.
• Analyze substrate signal integrity (SI) and power integrity (PI), providing feedback and collaborating with the layout team to develop optimal solutions across interposer, substrate, and PCB.
• Design, document, and develop ASIC packages for high-volume, high-quality release, including post-layout extraction and reporting.
• Collaborate with system partners, vendors, and design leads to achieve combined power and signal integrity and to resolve complex technical issues using advanced technology design rules.
• Define the processes, methods, and tools for the design and implementation of complex ASIC/package developments.
• Lead or participate in chip architecture discussions and the definition, architecture, and design of high-performance ASICs, including reviews of intricate IC and analog/mixed-signal circuit designs.
• Mentor and support the signal integrity team, junior engineers, and influence packaging/hardware teams, ensuring all technical specifications and innovative solutions are met.
• Develop and promote a culture of design reviews, postmortems, and continuous improvement across multi-disciplined engineering teams.

Qualifications

• Bachelor's degree in Electrical Engineering and 8+ years of relevant signal and power integrity experience, or Master's degree in Electrical Engineering and 6+ years of relevant signal and power integrity experience, or PhD in Electrical Engineering and 3+ years of relevant signal and power integrity experience.
• High-Speed Design & Theory: Experience with high-speed design principles, including Transmission Line Theory, electromagnetics, scattering parameters, and impedance network analysis, applied to 56G PAM4 SerDes architectures, channel modeling, and BER prediction.
• SI/PI Simulation Proficiency: Experience with pre- and post-layout signal and power integrity (SI/PI) simulations using industry-standard EDA tools such as Cadence Sigrity, Ansys HFSS, and Keysight ADS.
• Layout Review & Physical Validation: Experience conducting detailed layout reviews and physical design validation using tools such as Cadence APD and Ansys EM flows to ensure signal performance and crosstalk mitigation.
• Circuit Analysis: Experience with SPICE for circuit-level analysis, signal modeling, and performance validation.

Preferred Qualifications

• Skilled in articulating ideas and technical concepts to diverse audiences, both verbally and in writing.
• Experience with high-bandwidth memory (HBM) or high-speed memory interface SI.
• Experience with die-to-die interfaces (UCIe or proprietary).
• Experience with advanced packaging (CoWoS, EMIB, interposer-based designs), including SI/PI analysis of 2.5D ASIC packaging.
• Experience with Vector Network Analysis.
• Experience with IBIS.

Benefits

• Medical, dental and vision insurance.
• 401(k) plan with a Cisco matching contribution.
• Paid parental leave.
• Short and long-term disability coverage.
• Basic life insurance.
• 10 paid holidays per full calendar year, plus 1 floating holiday for non-exempt employees.
• 1 paid day off for employee’s birthday, paid year-end holiday shutdown, and 4 paid days off for personal wellness determined by Cisco.
• Non-exempt employees receive 16 days of paid vacation time per full calendar year.
• Exempt employees participate in Cisco’s flexible vacation time off program.
• 80 hours of sick time off provided on hire date and each January 1st thereafter.
• Optional 10 paid days per full calendar year to volunteer.