[Hiring] Director - AI Enterprise @Axelera AI

Role Description

We are looking for an entrepreneurial, technically exceptional engineering leader to establish and run Axelera’s AI Enterprise Division within the AI Integrated Systems (AIS) group. This is a new function, created to take our next-generation accelerator silicon into datacenter-class form factors from PCIe accelerator cards and OAM-class modules to full 1U/2U rack systems and dense compute nodes targeting enterprise AI, sovereign cloud and HPC customers.

You will build the team, shape the technical roadmap, and own end-to-end delivery of board- and system-level products for two strategic programmes. You will partner closely with the engineering leadership of the Embedded AI product line within AIS, the silicon organisation, the Voyager SDK/software group, and Axelera’s go-to-market teams serving hyperscalers, sovereign AI initiatives and the European HPC ecosystem.

This role is deeply hands-on. You will review schematics and layouts, challenge power and thermal budgets, shape the BMC and platform-firmware stack, and walk the lab floor during bring-up. Strategic leadership without technical depth will not work here.

Key responsibilities:

• Build the Enterprise AI Server engineering team from the ground up: hire, structure and mentor a multidisciplinary organisation covering hardware architecture, PCB design, power/thermal/mechanical engineering, firmware and platform validation with in-house and 3rd party resources.
• Define the technical roadmap for the division’s board- and system-level server products—PCIe Gen5/CXL accelerator cards, OAM-class modules, and full 1U/2U rack systems—aligned with the next-generation silicon roadmap.
• Serve as the technical authority across architecture, schematics, PCB stack-ups, high-speed signalling (PCIe Gen5/6, CXL, high-speed SerDes), enterprise memory, power delivery and VRM design, SI/PI methodology, and mechanical/thermal integration.
• Own end-to-end execution from concept through design reviews, bring-up, validation, reliability qualification, DFM/DFT/DFR and mass-production readiness, including NPI and ramp with tier-1 CMs and ODMs.
• Drive datacenter-grade platform engineering: BMC-based management, Redfish/IPMI, UEFI/BIOS firmware, secure boot and root-of-trust, platform firmware resilience, enterprise RAS features, and out-of-band telemetry.
• Lead the thermal and mechanical strategy for high-power accelerator platforms, including air-cooled rack designs and, where appropriate, direct liquid cooling (DLC) and immersion-ready variants.
• Ensure compliance with enterprise and datacenter standards: EN 55032/35 Class A, UL 62368, EN 50600 and NEBS where applicable, alongside OCP contribution/consumption where strategic for the division.
• Partner with the Embedded AI engineering leadership within AIS to align board- and system-level execution across the two product lines, sharing reference designs, validation assets and CM/ODM relationships wherever it accelerates both streams.
• Co-define platform requirements with the silicon, SDK and software teams, memory topology, interconnect fabric, power states, telemetry, so that the server products showcase the accelerator’s capabilities at rack and cluster scale.
• Engage directly with strategic customers, system integrators and ecosystem partners (hyperscalers, sovereign cloud operators, HPC centres, OEMs/ODMs) to shape requirements and win design-ins.
• Define and enforce engineering processes, documentation standards, validation methodologies and quality gates for the new division, mapped to Axelera’s NPD framework.
• Identify and mitigate technical risks, resolve engineering escalations, and drive debugging and root-cause analysis during development, qualification and early production.
• Own the division’s engineering budget, CAPEX, external engineering spend and vendor relationships.

Qualifications

• 15+ years in hardware engineering for complex electronics products, with at least 5 years in senior leadership roles running multidisciplinary teams.
• Proven track record of shipping datacenter- or server-class compute hardware into volume production: accelerator cards, GPU/xPU-class modules, server motherboards, compute nodes or rack-level systems.
• Deep expertise in high-speed interfaces (PCIe Gen4/5/6, CXL, high-speed SerDes), enterprise memory, high-current power delivery and VRM design, and high-density PCB layout with rigorous SI/PI methodology.
• Experience with BMC-based platform management, Redfish/IPMI, UEFI/BIOS or equivalent firmware stacks, secure boot/root-of-trust, and enterprise RAS features.
• Working knowledge of datacenter thermal and mechanical design: air-cooled 1U/2U chassis, direct liquid cooling and/or immersion-ready platforms, and rack power delivery at 12V, 48V and OCP power-shelf level.
• Familiarity with datacenter and enterprise compliance (EN 55032/35 Class A, UL 62368, EN 50600, NEBS where relevant) and with OCP standards and contribution/consumption processes.
• Experience working with tier-1 CMs/ODMs on server-class products, including DFM, MP transfer, yield ramp and sustaining engineering.
• Hands-on ability to review schematics, layouts, simulation results and lab validation data, and to make the call when the team is stuck.
• Strong strategic thinker, excellent communicator, skilled at decision-making in fast-moving environments, comfortable engaging at C-level with customers and partners.

Requirements

• Experience building or significantly scaling an engineering team is strongly preferred.
• Experience with AI accelerator platforms, GPUs or custom silicon in a datacenter context is a strong plus.
• Exposure to sovereign AI, EuroHPC, HPC or European defence/dual-use datacenter programmes is a plus.
• Fluent English required; additional European language is a plus.

Benefits

• Attractive compensation package, including a pension plan, extensive employee insurances and the option to get company shares.
• An open culture that supports creativity and continual innovation.
• Collaborative ownership and freedom with responsibility is characteristic for the way we act and work as a team.
• Commitment to cultivating a warm and inclusive environment that empowers and celebrates every member of our team.